CVP Wafer Contouring Vertical Polisher

Wafer Edge Contouring Machine

This ground-breaking chamfering system can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel. Edge processing of the device wafer prior to BG decreases the amount of wafer breakage or chipping after BG. We also make a Bevel machine designed to form an edge on 2 inch to 8 inch diameter wafers. The Bevel Machine can process materials such as silicon, and many other semiconductive subtrates. 

 

Contouring Vertical Polisher Machine Features

• Two grinding stations
• Enhanced processing accuracy and shortened processing time by using the Twin-contouring" method, compared to the conventional machine.
• Reduced processing time compared to the conventional machine.
• A built-in wafer profile measurement device is available.
• Enables measurement of the cross-section profile after processing for feedback correction of the processing data.

Basic CVP Specifications

• Wafer type: Notch
• Wafer Size: 12 in or 8 in (selectable)
• Loading/Unloading: 8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte) (selectable)
• Thickness Measurement Unit: Multi-point measurement
• Fine alignment: Edge contact or non-edge contact
• Qty of grid axis: Two stations
• Spindle: [1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional), [2] Vertical circumference contouring (finish) Resin bonded wheel (60mm), [3] Vertical circumference contouring 2 (finish) Resin-bonded wheel (60mm) (Optional), [4] Notch grinding (horizontal)
• Metal-bonded wheel (Optional)
• Washing Unit: Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
• Profile Measurement: Measurement items: cross-section profile, notch profile, diameter, notch vertical surface width

 

	CVP-80	CVP-211B	CVP-310B	CVP-320
Wafer type	OF(CF) or Notch	OF(CF) or Notch	OF or Notch	Notch
Wafer size	2-inch to 8-inch	2-inch to 6-inch	12-inch or 8-inch, 6-inch	12-inch or 8-inch (selectable)
Loading/Unloading	None	4-cassette	4-cassette (or 2-cassette) or 1 dry stack-to-1 dry stack (selectable)	8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte) (selectable)
Thickness measurement unit	None	Multi-point or a center point measurement (Optional)	Multi-point or a center point measurement (Optional)	Multi-point measurement
Fine alignment	Contact type	Edge contact or Non-edge contact	Edge contact or Non-edge contact (selectable)	Edge contact or Non-edge contact
Qty of grind axis	One station	One station	One station	Two stations
Spindle	[1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional)	[1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional)	[1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional)	[1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional)
	[2] Vertical circumference contouring (finish) Resin-bonded wheel (50mm)	[2] Vertical circumference contouring (finish) Resin-bonded wheel (60mm)	[2] Vertical circumference contouring (finish) Resin bonded wheel (60mm)	[2] Vertical circumference contouring (finish) Resin bonded wheel (60mm)
		[3] Vertical circumference contouring 2 (finish) Resin-bonded wheel (60mm) (Optional)	[3] Vertical circumference contouring 2 (finish) Resin-bonded wheel (60mm) (Optional)	[3] Vertical circumference contouring 2 (finish) Resin-bonded wheel (60mm) (Optional)
		[4] Notch grinding (horizontal) Metal-bonded wheel (Optional)	[4] Notch grinding (horizontal) Metal-bonded wheel (optional)	[4] Notch grinding (horizontal) Metal-bonded wheel (Optional)
Washing unit	None	Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)	Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)	Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
Diameter measurement	None	Included	Included	Measurement items: cross-section profile, notch profile, diameter, notch vertical surface width

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