WBM Wafer Bevel Machine

Daitron's WBM -2000A Series Wafer Bevel Machine accurately grinds wafer edges with extreme precision and quality without damaging the material, compatible with wafer sizes of 2 to 8 inches. It offers a compact design, superior precision beveling, and exceptional versatility. This wafer edge grinder can process various materials, including silicon and other semiconductive substrates. The WBM-2000A Series model is the successor to the revered DE(N)P series, offering enhanced functionality and efficiency.

We also manufacture and distribute the CVP Wafer Contouring Vertical Polisher, an innovative chamfering system that utilizes the same resin-bonded wheel to shape the edge of an AS-slice wafer into either a trapezoid or radius shape.

WBM-2000A Series Wafer Edge Grinder Features

The WBM-2000A Series Wafer Bevel Machine has undergone several significant upgrades. The motor for grinding the Y-axis and Z-axis was converted from a stepping motor to an AC servomotor for higher precision. With a state-of-the-art mechanical layout, featuring the Wafer Transfer Unit in the center of both grinding stations, this wafer edge grinder technology has reduced transfer distance and enhanced efficiency. Additional advantages of using the Daitron’s wafer edge grinder technology include:

• Compact Design - 50% less footprint area compared to existing model DENP-250A and competitors
• High Accuracy - Using a one-piece cast iron frame, the vibration during grinding was better controlled, reducing damage and minimizing chipping.
• High Machine Stiffness - To obtain higher stiffness of the spindle unit, Z-axis movement from the spindle was eliminated.
• OF Linearity Improved by 33% - OF linearity specification has been improved from 15um to 10um. By consolidating the X-Y- θ -Z unit into one unit, instead of having two separate moving units, OF linearity specification has been improved. 
• Easy Maintenance - Improved accessibility to all internal mechanisms and controls makes the WBM-2000 easier to maintain. Grinding wheel change can be accomplished with convenient access from the side. The result is higher productivity with less downtime.
• Easy Operation - Operator control using LCD touch panel and easy-to-understand menu screens.
• High Efficiency - Max 163 wfrs / hr with max speed of 22 sec / wfr. (15 sec / wfr using dual-axis model) with wafer exchange time of 10 sec / easy-to-understand (WBM-2200)

Wafer Grinder Capabilities & Basic Specifications

*Cassettes: Number of cassettes is dictated by wafer size.
*Non-symmetric and step- or terrace-type: Grinding wheel shape will reflect the bevel shape.
*Note: Specifications above may change without notice.

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